ALPHA® AccuFlux™ BTC-578 Preforms

Thermal Management through Void Reduction on Bottom Termination Components

Voiding requirements are becoming more challenging as component packages shrink and power densities increase. ALPHA® AccuFlux™ BTC-578 Preforms are designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components. AccuFlux™ BTC-578 technology is a precision controlled micro-flux coating applied to solder preforms to promote repeatable wetting, spread, and voiding on large area substrates such as bottom termination components.


  • ROL0, RoHs compliant, zero-halogen
  • 1.4mm x 1.4mm minimum length x width
  • 0.100mm – 0.150mm thickness
  • 300µg/cm2 +/- 80 µg/cm2 AccuFlux™ BTC-578 coating thickness
  • Tape & Reel in 7” & 13” diameter, Trays
  • All SAC Alloys, Innolot, & Low-Temp SnBi Alloys


  • Effective heat dissipation through consistent voiding as low as 2%
  • Enhanced process stability and predictable reliability through repeatable void distribution
  • Prevents mechanical stack-up issues between thermal pads and signal leads through increased solder volume to create repeatable bond line
  • Maximizes mechanical integrity through increased solder volume
  • Enhanced electrochemical reliability on shrinking component packages through low flux residue

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