ALPHA® PowerBond® 2110 Preforms

For High Creep Resistance and Thermal Conductivity

ALPHA® PowerBond® 2110 preforms balance high creep resistance of Sn90Sb10 system with high thermal conductivity required for the power semiconductor devices operating at high junction temperatures (150-175°C). The alloy composition has been particularly tailored to enable easy wetting and low voiding.

Features

  • High creep resistance and tensile strength with high thermal conductivity than traditional Pb-free alloys
  • Excellent voiding with easy wetting

Benefits

  • Excellent lead-free alternative to high lead alloy applications
  • Capable for processing in traditional SMT lines as well as vacuum soldering ovens (with formic acid)
  • Reduced solder defects through special Vaculoy process
 
  
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