Solder Preforms for Power Semiconductor

High Reliability Alloys for Power Module and Power Discrete Applications

ALPHA® Solder Preform technology offers high reliability alloys for power module and power discrete applications. Low voiding and low spatter can be achieved in vacuum solder applications. Additionally, targeted bondline control products offer repeatable package reliability.

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ALPHA® TrueHeight® Preforms

Prevents die tilt with repeatable bondline thickness (BLT)

ALPHA® PowerBond® Preforms

High reliability alloys containing antimony for increased strength and thermal fatigue resistance.

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