ALPHA® Argomax® 2000 Series

Argomax® 2000 series from Alpha was specifically developed for low pressure sintering die attachment.  It is formulated using highly engineered silver particles, manufactured by Alpha.

Argomax 2000 series provides high thermal and electrical conductivity silver bonds between the die and substrate, good adhesion and flexible bond line thickness.  Designed into Argomax 2000 series is excellent shelf life and reproducible print characteristics.

Features and Benefits
  • Low process temperatures 200-300ºC. Can be processed at up to 500ºC
  • Recommended sintering pressure 5-10 MPa or higher
  • High thermal conductivity silver bond line in the range of 200-300 W/mK
  • Consistent print and dispense characteristics
  • Long shelf life and easy start up


Argomax® 2000 Series


Paste – Printing or Dispensing

Sintering Temperature


Thermal Conductivity


Common substrates

DBC, Copper substrates for power module

Surface Finish Compatibility

Ag, Au

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