Solder Paste

ALPHA CL-78 is a no-clean, dispensable solder paste compatible with the Alpha UP-78 series of modern, no-clean pastes. It is designed for high speed automated or manual dispensing through a wide range of needle sizes. The post reflow residues are clear and colorless.

Process Features and Benefits

  • Processed and packaged void-free to assure consistent dispensing results.
  • Clear, colorless, tack-free residue for the best board cosmetics.
  • Reliable, non-clogging dispensing down to .008” I.D. needles.
  • Rheology to provide continuous, high speed dispensing (thousands of dispenses per hour) in modern positive displacement dispenser.
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