Solder Paste

ALPHA® CVP-360 is a lead-free, halogen free no-clean solder paste designed for a broad range of applications. ALPHA CVP-360 is designed to enable the use of ALPHA SACX alloys, while offering reflow process yields comparable with higher silver SAC alloys (SAC 305 and SAC 405). CVP-360 also offers extremely high in circuit pin test yields, which can reduce the circuit board assembly process cycle time due to fewer false negative rework steps. CVP-360’s excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Until now, solder paste with high spread and wetting properties with low silver SAC alloys have had poor in circuit pin test yields, high halogen levels, or both. CVP-360 eliminates the need to compromise properties when using either ALPHA SACX Plus 0307 SMT or ALPHA SACX Plus 0807 SMT alloys.

Features and Benefits
  • Very high reflow process yields on Entek Plus HT OSP, even after 1 prior lead-free reflow.
  • Excellent pin-test yield for single and double reflow assemblies. 
  • Excellent print volume consistency with high process capability index across all board designs. 
  • Enables the use of ALPHA SACX® alloys to minimize the impact of silver’s price volatility.
  • Excellent solder and flux cosmetics after reflow soldering.
  • Reduction in random solderballing levels, minimizing rework and increasing first time yield.
  • Halogen free per IPC J-Std 709.
  • Halide free per IPC J-Std 004.
  • Meets IPC 7095 voiding performance classification ll or lll depending on reflow profile, feature size and BGA alloy. 
  • Meets IPC and Bellcore Electrical Reliability requirements.
  • Excellent reflow yields without the need for nitrogen.

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