Zero-halogen, Lead-Free, No-Clean solder paste

ALPHA CVP-390V is a lead-free, no-clean solder paste designed to maximize flexibility in manufacturing and provide superior electrochemical reliability in challenging applications such as automotive, military/aerospace, industrial, consumer and computing.

Enhanced Reliability on Complex PCB Designs
ALPHA CVP-390V exhibits best-in-class electrochemical reliability down to 0.100mm comb spacing against the most challenging SIR profiles. The ability to maintain high electrochemical performance in harsh operating conditions on dense assembly designs makes ALPHA CVP-390V ideal for high reliability applications.  

ALPHA CVP-390V delivers consistent performance on all package configurations and board types with excellent transfer efficiency at AR>0.60 and wide reflow window on soak and ramp profiles enabling flexibility under all process conditions. 

Key Features:

  • Superior electrochemical performance on fine pitched components to ensure reliability on complex PCB assemblies 
  • Ultimate flexibility in print and reflow process window
  • Excellent coalescence down to 170 µm apertures on high density assemblies
  • Exceptional pin testability to ensure first pass yields
  • Robust performance for consistency across all packaging configurations
  • Compatible with SAC305 and the Innolot high reliability alloy


CVP-390V Chart


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