ALPHA® JP 501 Solder Paste

Lead-free, Low Temperature, Zero Halogen, No Clean Solder Paste for Jet Printing

ALPHA® JP-501 is a lead-free, no-clean solder paste designed for use in Jet Printers. ALPHA JP-501 features a rheology capable of standard dispensing or jetting.  The low temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C, and has been successfully used with peak reflow profiles between 155 and 190°C.  The flux residue from ALPHA JP-501 is clear and colorless and is formulated to offer high electrical reliability in a zero halogen flux formulation. Outstanding reflow process window delivers good soldering on CuOSP, lead free HASL, Immersion Silver, Immersion tin and ENIG surface finishes. Additionally, ALPHA JP-501 is rated ROL0 per IPC J-STD-004. All components used with ALPHA JP-501 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.


Features & Benefits

  • Reduces energy consumption in reflow ovens versus standard lead free alloys.  
  • Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate.
  • Excellent deposit consistency with high process capability index across all board designs.  
  • Designed for use with the Mycronic Jet Printers.
  • Zero Halogen (no halogen intentionally added to the formulation)
  • Wide reflow profile window with good solderability on various board / component finishes.
  • Excellent solder and flux cosmetics after reflow soldering 
  • Reduction in random solderballing levels, minimizing rework and increasing first time yield 
  • Excellent pin-test yield for single and double reflow.
  • Excellent reliability properties, zero halide material 
  • Capable of high reflow yield without the use of nitrogen
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