ALPHA® OM-220

Ultra-Low Temperature Solder Paste

ALPHA OM-220 is a new, ultra-low temperature solder paste paired with ALPHA ULT1 alloy intended for soldering of temperature-sensitive components and substrates. This innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies.

Ultra-Low Temperature Solder Solutions (ULTS) capable of Soldering Heat-Sensitive Components (<150°C)

ALPHA OM-220 innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. 

ALPHA OM-220 permits cascaded / hierarchical soldering, as well as novel hermetic sealing solutions. This technology is well suited for a broad range of end use applications including computers, smartphones, various consumer electronics, in-cabin automotive electronics, and medical devices.

 Key Benefits:

  • Low reflow peak temperature < 150 °C
  • Enables use of lower cost substrates & components
  • Reduction of warpage (component & substrate) vs SAC process
  • Excellent electrical reliability; passes JIS Z 3197 & J-STD-004B SIR testing
  • Exhibits low voiding characteristics; passes IPC Class 3 voiding on BGA components
  • Halide-free & zero-halogen compliant
 

 
  
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