Solder Paste

ALPHA® OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-340 provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications.

Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.

Features & Benefits

  • Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils
  • Excellent print consistency with high process capability index across all board designs
  • Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput
  • Wide reflow profile window with good solderability on various board / component finishes
  • Excellent solder and flux cosmetics after reflow soldering
  • Best in class low defect rate for Head in Pillow
  • Best in class in circuit pin test yield
  • Reduction in random solderballing levels, minimizing rework and increasing first time yield
  • Meets highest IPC 7095 voiding performance classification of Class III
  • Excellent reliability properties, halide-free material
  • Compatible with either nitrogen or air reflow
  • Zero halogen (No halogen intentionally added to the formulation)
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.
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