Lead-Free, Zero-Halogen Solder Paste for Ultra-Fine Feature Applications

ALPHA® OM-353 is a lead-free, zero-halogen solder paste designed to meet market segments requiring ultra-fine feature applications.  It has been tested to give excellent printing performance down to 180µm pad size. ALPHA® OM-353 residue is designed to remain on the solder joint to enhance electrochemical reliability and prevent solder wicking on component leads. 

ALPHA® OM-353is a is a No-Clean, Lead-Free, Zero-Halogen, ROL0, Ultra-Fine Feature Print & Air Reflow Capable Solder Paste: OM-353 Paste Tube and Jar

  • Type 4 & Type 5 no-clean paste
  • Available in 500 gram jars, 6” & 12” cartridges
  • Available in SAC305, SAC105, SACX™ Plus 0307, Maxrel™, & Maxrel™ Plus alloys

Assembly processes that can gain from ALPHA® OM-353 Solder Paste are:

  • Assemblies with fine features
  • Assemblies sensitive to component warpage
  • Processes that currently require cleaning
  • Components sensitive to flux wicking
  • Assemblies which do not require SAC305

ALPHA® OM-353  key attributes are:

  • Long Stencil Life: engineered for consistent performance in warm/humid production climates, reducing variations in print performance and paste dry-out.
  • High Tack Force Life: ensures high pick-and-place yields, good self-alignment.
  • Wide Reflow Profile Window: enables quality soldering of complex, high density PWB assemblies in an N2 environment, using high ramp rates and soak profiles as high as 170°C to 180°C.
  • Reduced Mid Chip Solder Balling,  Head-in-Pillow: minimizes rework and increases first time yield
  • Air Reflow Capable: shown to yield good coalescence for 160µm circle deposits using an air reflow high soak.
  • Excellent Solder Joint and Flux Residue Cosmetics: residue does not char or burn after



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