No-Clean, Halogen-free, Lead-free Solder Paste

ALPHA® OM-363 is a lead-free, halogen-free, no-clean solder paste designed for minimizing BGA non-wet opens and head in pillow defects. This paste chemistry continues Alpha’s tradition of being an industry leader in providing excellent pin testing property for high first pass ICT yields.

ALPHA® OM-363 solder paste is also designed to enable consistent fine pitch printing capability, down to 180mm circle printed with 100mm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Additionally, ALPHA® OM-363 solder paste achieves IPC7095 Class III voiding performance.

Features & Benefits

  • Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition of new paste
  • Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment
  • Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
  • Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
  • Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high soak profile environment
  • Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermal soaking, without charring or burning
  • Excellent Voiding Performance: Meets IPC7095 Class III Requirement
  • Halogen Content: Halogen-free
  • Residue: Excellent Pin Testing property
  • Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements (see table below), as well as TOSCA & EINECS

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

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