ALPHA® WS-852 is a SnBiAg low temperature, water soluble solder paste designed for a broad range of SMT processes where aqueous post reflow cleaning is required.  The low temperature, lead-free alloy enables lower temperature processing of surface mount technology.  The SnBiAg alloy reflows between (160-190)oC. 


The carefully selected Sn/Bi/Ag alloy in ALPHA® WS-852 was selected to give the lowest melting point, lowest pasty range during melting and re-solidification, along with a very fine grain structure, offering maximum resistance to thermal cycle fatigue.  The alloy also yields very low voiding BGA solder joints, even when traditional SAC alloy spheres are used.


All components used with ALPHA® WS-852 must be lead free to eliminate the formation of a tin/lead/bismuth intermetallic which has a melting point under 100oC.

Features & Benefits

  • Reduced energy consumption in reflow ovens versus standard lead-free alloys.
  • Reduced reflow process time.
  • Excellent volume transfer efficiency over a broad range of environmental conditions.
  • High throughput and yield with consistent print volumes at print speeds ranging from (1-6) inches per second.
  • Exhibits resistance to slumping and drying at temperatures up to (66-84)oF/(19-29)oC and relative humidity extremes (35-65)%RH
  • Water cleanable after two solder paste reflow cycles. 
  • Superior solder spread and wetting on all commonly used lead free surface finishes (Entek HT, Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
  • Meets highest IPC 7095 voiding performance (Class III).
  • Low temperature reflow profiles may enable the use of less expensive printed circuit substrates, when appropriate.
  • Compatible with either nitrogen or air reflow.
  • Excellent overprint capability for paste in hole printing.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.


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