Wave Solder Bar

ALPHA® SACX Plus® 0307 HASL is a lead-free alloy suitable for use as a replacement for Sn63 alloy in the hot air solder level process. The SACX0300 HASL variant is used to stabilize / reduce the copper content in the hot air solder level machine solder bath, this requirement will depend on process conditions. As with all Alpha Metals bar solder, Alpha’s proprietary Vaculoy™ alloying process is used to remove certain impurities, particularly oxides. The product is further enhanced with the addition of 2 minor elements to reduce copper dissolution rates and improve the pad cosmetics.

Features & Benefits

  • Copper Dissolution Rate – Low copper dissolution rate, reduced solder-pot maintenance and improved bath life.
  • Wetting Speed – 0.75 seconds typical wetting speed compares to SAC305 at 0.65 sec and superior to Sn99.3/Cu0.7 base alloys at 1.0 sec.
  • Flat Uniform Deposits – less thickness variance than Sn63/Pb37
  • Lowers Total Cost of Ownership due to the lower material cost, high yields and low copper dissolution rates.
  • Gives very good solderability due to the fast wetting speed.
  • Compatible with all assembly SAC (Sn/Ag/Cu) based alloys SACX, SAC305 etc.
  • Excellent shelf life and ultimate solderability – will improve hole fill on multiple reflow boards.

The proprietary Vaculoy process is a highly effective method for removing included oxides from solder. This is extremely important because included oxides generate excessive drossing and increase the viscosity of the solder. Solder with higher
viscosity can result in increased soldering defects (i.e solder bridging).

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

(Press ctrl to select multiple)