ALPHA® SnCX Plus™ 07

Lead Free Wave Solder and Rework Alloy

ALPHA® SnCX Plus™ 07 is No-silver lead-free alloy suitable for use as a replacement for SnPb, SAC305 and other low silver SAC alloys in wave solder, selective soldering, lead tinning and rework processes. SnCX Plus™ 07 has been engineered to minimize copper dissolution as compared to silver-bearing alloys and also to improve total cost of ownership. The SnCX Plus™ 00 variant is used as a replenishment alloy in solder baths with elevated copper levels.

As with all Alpha Metals bar solder, Alpha's proprietary Vaculoy manufacturing process is used to remove certain impurities, particularly oxides. The product is further enhanced with the addition of other elements designed to further improve alloy physical and mechanical properties, reduce drossing, increase wetting speed and force and improve joint reliability.

SnCX™ is an ideal, cost effective solution for LED Power Driver and Board Assemblies due to ZERO silver. Furthermore, SnCX™ produces shiny and smooth finish with no nucleation holes provide excellent reflectivity for lumen output.

Features & Benefits

  • Reliability – Comparable to silver bearing alloys (i.e. SAC305) and other enhanced Sn99.3Cu0.7 alloys in thermal fatigue resistance, lap shear and pin pull performance.
  • Yield – Excellent production yields. Outperforms Sn99.3Cu0.7 based materials.
  • Copper Erosion – Low erosion in long, hot exposure soldering process.
  • Dross Generation – Lowest in class due to the Vaculoy process in conjunction with the addition of a dross reducing agent.
  • Solder Fillet Surface – Smooth and bright with no surface crack
  • Lowers Total Cost of Ownership due to the lower material cost, high yields and low copper dissolution rates.
  • Gives very good solderability due to the fast wetting speed.
  • Reduces erosion of copper plating during rework which improving assembly reliability.
  • Friendlier and less aggressive to solder pot material as compared to silver-bearing alloys.
  • Delivers good performance across different soldering processes.
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