ALPHA® Hi-Tech™ Underfills are designed for application in Automotive, Smartphone, Tablet, Notebook, and other portable related products. Users of the ALPHA® Hi-Tech™ Underfills can benefit from the following key product features:
- Excellent Adhesion to FR4
- Fast Flow / Penetration
- Fast Curing Performance
- Excellent Drop Shock
- Reworkable
- Halogen Free

CU13-3150
Low Temperature Cure Underfill
ALPHA® HiTech™ CU13-3150 is a one-component, low temperature thermal cure capillary underfill. It is designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
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CU32-380
Low Viscosity Underfill
ALPHA® HiTech™ CU32-380 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
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CU31-3100
High Tg, Low CTE Underfill
ALPHA® HiTech™ CU31-3100, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages.
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CU11-3127
High Tg, Low CTE Underfill
ALPHA® HiTech™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.
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