Underfill


ALPHA® HiTech™ Underfills are one component, heat curable materials. They are epoxy based materials to be dispensed on the edges of the BGA, CSP or Flip Chip devices. The material then flows beneath the component through capillary action.  Upon completion of the curing process, the cured underfill helps strengthen the soldered assembled component allowing it to pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).


 

ALPHA® Hi-Tech™ Underfills are designed for application in Automotive, Smartphone, Tablet, Notebook, and other portable related products. Users of the ALPHA® Hi-Tech™ Underfills can benefit from the following key product features:

  • Excellent Adhesion to FR4
  • Fast Flow / Penetration
  • Fast Curing Performance
  • Excellent Drop Shock
  • Reworkable
  • Halogen Free

Underfill             underfill


CU13-3150

Low Temperature Cure Underfill

ALPHA® HiTech™ CU13-3150 is a one-component, low temperature thermal cure capillary underfill.  It is designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.

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CU32-380

Low Viscosity Underfill

ALPHA® HiTech™ CU32-380 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.

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CU31-3100

High Tg, Low CTE Underfill

ALPHA® HiTech™ CU31-3100, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. 

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CU11-3127

High Tg, Low CTE Underfill

ALPHA® HiTech™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.

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