ALPHA® HiTech™ CU32-380

Low Viscosity Underfill

ALPHA® HiTech™ CU32-380 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.

ALPHA® HiTech™ CU32-380 does not contain any fillers. Its low viscosity allows for fast flow and penetration under the component, thus no preheat is required during the dispensing process.

Key Features:

  • Low Viscosity, enabling fast and efficient flow properties
  • Low Moisture Absorption
  • Releases stress over a large area, primary stress is CTE mismatch between component and board
  • Excellent Resistance to impact forces; No impact bend failure on boards after 10,000 cycles
  • Excellent Resistance Drop Shock
  • Halogen Free
  • Complies with RoHS Directive 2011/65/EU
 
  
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