ALPHA® HiTech™ CU11-3127

High Tg, Low CTE Underfill

ALPHA® HiTech™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA® HiTech™ CU11-3127 protects the solder joints from mechanical stresses such as drop shock and impact bending. 

ALPHA® HiTech™ CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. ALPHA® HiTech™ CU11-3127 has a unique low viscosity property, thus no preheat is required for this product.   

Key Features:

  • Low Viscosity, enabling fast and efficient flow properties 
  • Low Moisture Absorption
  • Releases stress over a large area, primary stress is CTE mismatch between component and board
  • High Glass Transition Temperature
  • Low Coefficient of Thermal Expansion
  • Halogen Free
  • Complies with RoHS Directive 2011/65/EU
 
  
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