ALPHA® HiTech CU21-3240

Underfill Epoxy for protecting assembled chip packages

ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability.

ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion.

 

Key Features:

  • Provides full component coverage when dispensed onto the substrate preheated at 70 to 100 °C.
  • High Tg and Low CTE values drastically improve the product’s ability to pass a more stringent Thermal Cycling Test condition.
  • Excellent Thermal Cycling Test performance.
  • Halogen-free and complies with RoHS Directive 2015/863/EU.

 

underfill

 
  
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