ALPHA® HiTech CU31-2030

Reworkable Underfill Epoxy for protecting assembled chip packages

ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.

ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties.  In addition, it has a high Tg and low modulus which results in excellent reliability performance. ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices.  All ALPHA HiTech products are Halogen Free.

 

Key Features:

  • Low Viscosity
  • Room temperature flow capability
  • High Glass Transition Temperature (Tg)
  • Low Modulus
  • Reworkable
  • Excellent Reliability performance
  • Halogen-free and complies with RoHS Directive 2015/863/EU

 
  
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