This website uses cookies to give you the best browsing experience possible and to better understand how you use the Alpha Assembly site. By clicking the Accept and close button you consent to the use of cookies. If you do not wish to have cookies enabled please see our Privacy policy to learn how to disable your cookies.

ALPHA® HiTech Underfills

ALPHA HiTech Underfills are one component, heat curable materials. They are epoxy based materials to be dispensed on the edges of the BGA, CSP or Flip Chip devices. The material then flows beneath the component through capillary action.  Upon completion of the curing process, the cured underfill helps strengthen the soldered assembled component allowing it to pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).

 

ALPHA Hi-Tech Underfills are designed for application in Automotive, Smartphone, Tablet, Notebook, and other portable related products. Users of the ALPHA Hi-Tech Underfills can benefit from the following key product features:

  • Excellent Adhesion to FR4
  • Fast Flow / Penetration
  • Fast Curing Performance
  • Excellent Drop Shock
  • Reworkable
  • Halogen Free

Underfill             underfill

CU13-3150

Low Temperature Cure Underfill

ALPHA HiTech CU13-3150 is a one-component, low temperature thermal cure capillary underfill.  It is designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.

Learn more

CU32-380

Low Viscosity Underfill

ALPHA HiTech CU32-380 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.

Learn more

CU31-3100

High Tg, Low CTE Underfill

ALPHA HiTech CU31-3100, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. 

Learn more 

CU11-3127

High Tg, Low CTE Underfill

ALPHA HiTech CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.

Learn more

CU31-2030

High Tg, Low CTE Underfill

ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. 

Learn more

CU21-3240

High Tg, Low CTE Underfill

ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards.

Learn more 

 

For more information on this topic please enter your contact information

*   
*
*
*
*
*
*
(Press ctrl to select multiple)
* Required