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Voiding

Voids, or gas entrapment in solder joints, have been a long-time concern in the electronic assembly industry.  Alpha reduces voiding in the lead-free processing of fine feature area array devices with specially designed solder pastes and copper-filled microvias.  Together, they significantly reduce void formation by allowing air to escape during reflow.

Alpha products that reduce voiding:

Solder Paste

  • TBD

 

Solder Preforms

Size Dimensions Volume Pb-Free Sn-Pb SnBiAg
a b c
inch mm mm mm3
0201 0503 0.51 0.25 0.25 0.032   X  
0201S 0403 0.44 0.28 0.28 0.034 X    
0202 0505 0.51 0.51 0.25 0.065 X X  
03015 0838 0.76 0.38 0.25 0.072   X  
03015S 06035 0.60 0.35 0.35 0.074 X    
0402H 1006H 1.00 0.60 0.25 0.150 X X *
0402 1006 1.00 0.50 0.50 0.250 X X X
0402B 10055 1.00 0.55 0.55 0.303 X X *
0603H 1608H 1.60 0.80 0.50 0.640 X X *
0603 1608 1.60 0.80 0.80 1.024 X X X
0805H 2013H 2.01 1.30 0.40 1.045 X X *
0805 2013 2.01 1.30 0.76 1.986 X X X
0805S 2013S 2.01 1.30 1.30 3.397 X X *
1206 3015 3.00 1.47 0.77 3.396 X X *
1406 3515 3.56 1.52 0.77 4.167 X X *

*production will depend on market demand, please check with your local sales representative for availability

 


 
  
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