Ball Grid Array (BGA) Warpage

Warpage of BGA surface-mount packaging generally occurs at the corners or at center of the array during reflow heating.  Alpha has conducted numerous studies to observe the behavior of solder joints under these conditions.  To combat BPA warpage, Alpha specifically engineers solder material with high metal loading for enhanced viscosity.  Our solder pastes also maintain heavy solder particles in suspension to prevent slump due to gravity.

Alpha product that helps to avoid BGA Warpage:

Solder Paste

 

Solder Preforms


Whitepapers

High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys for Ball-Grid Array Package Applications - Download Whitepaper

 
  
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