Do You Need to Add More Solder Paste to Create Stronger Joints in Your Mobile Device Assembly Process?

Posted 12/03/2013 by $username

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Traditional screen printing processes can fail to deliver adequate solder paste volume during the assembly of today’s very thin mobile devices.  This can be the case for difficult applications like flexible boards, cavity printing, and challenging components, such as RF shields, connectors and RF power components on highly populated boards.  Additional solder can be jetted on to pads in board cavities and on to printed paste deposits to achieve the proper solder volume needed in these challenging types of assembly processes without adding significant process time.  Jet printing provides complete volume control in which paste deposits can be optimized for each individual pad on a PCB.  Recent studies carried out by Alpha have shown that screen printing and jet printing can be combined on the same board without affecting solder joint quality.

ALPHA® JP-500 is a lead-free, zero-halogen, no-clean solder paste engineered specifically for jet printing using the MYDATA® MY500 Jet Printer, and standard dispensing with excellent deposit consistency, while offering best in class in circuit pin test yields and high electrical reliability.  A collaboration between Alpha and MYDATA has led to the recent addition of low temperature jet printing solder pastes.  As presented at an APEX seminar in Feb. 2013, this expands the capabilities of jet printing on highly populated boards. 

ALPHA® JP-500’s  wide  reflow process window delivers excellent soldering on CuOSP, lead-free HASL, Immersion Silver, Immersion tin and ENIG surface finishes.  In addition, ALPHA® JP-500 Jetting Paste meets the highest IPC 7095 voiding performance classification of Class III, reduces random solder balling levels, minimizes rework and is formulated to deliver excellent solder and flux cosmetics after reflow soldering. It is rated ROL0 per IPC J-STD-004.  ALPHA® JP-500 maximizes reflow yields for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.10”).

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