Low Temperature Processing Delivers Reliable Joints and Lower Total Cost of Ownership

Posted 07/17/2012 by $username

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One of the biggest drivers for using a low melting point alloy for SMT is the potential to eliminate wave soldering which can provide the greatest opportunity to create value when converting to a low temperature alloy.  In a multi-technology process, there are either 1 or 2 SMT steps followed by a wave or selective soldering step.  In the Dual Alloy SMT process, the wave solder step is completely eliminated and replaced by a low temperature SMT step.  By implementing an SMT-only process, a more streamlined, higher throughput process can be established.

In addition to streamlining production, other areas of value creation from low temperature SMT processing include: lowering the oven maintenance costs, potentially using lower cost laminates that do not need to withstand multiple high temperature thermal excursions, and lowering overall energy consumption by eliminating the wave soldering equipment.

CVP-520 Solder Paste

The points laid out above are not a theoretical exercise.  Alpha has worked with customers making flat panel TV displays, TV Tuners, remote controls, TV set top boxes, LEDs, air bag release, electric shavers, electrical meters, and thermal modules for conversions to low temperature SMT processing.  In each case, these manufacturers validated the mechanical reliability of joints made with ALPHA® CVP-520 to be sufficient for their application.  In doing this work, Alpha has collected data from several thermal cycle regimes to demonstrate the long term durability of the SnBiAg alloy system.

Please reach out to your Alpha Sales and Customer Technical Support Engineering Team today to see how we can work together to co-create value using this innovative SMT process.