Void Reduction Solutions

ALPHA® Void Reduction Solutions is a proven methodology to address all types of voiding issues in SMT assembly. It starts as an engineering engagement with our customer to understand critical process parameters, design factors, and equipment information that could impact void performance. Our team of experts will analyze your process and develop an engineered recommendation addressing material sets, equipment settings, and stencil design strategies to produce your desired voiding levels.

Alpha Void Reduction Solutions Banner

Let's get started button

Take our online survey.

If you have the commitment to make your SMT process cutting-edge efficient, we’re here for you.  

Blue Bar

RVS Headline

Void reduction is complex. A number of factors contribute to void generation, so in order to address this common problem, Alpha is focused on understanding all the variables:

Process Expertise

PCB Design
Reflow Profile
Surface Finish
Machine Parameters

Innovative Products

Solder Paste
Solder Preforms
High Reliability Alloys
Stencil Design


For more information on this topic please enter your contact information

(Press ctrl to select multiple)
* Required