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Alpha to Host LED Seminar and Showcase High Reliability LED Packaging & Assembly Materials at GILE 2017 in Guangzhou

Contact
Gyan Dutt
Gyan.Dutt@alphaassembly.com
+1-908-791-3000

Alpha to Host LED Seminar and Showcase High Reliability LED Packaging & Assembly Materials at GILE 2017 in Guangzhou

Somerset, NJ – June 01, 2017

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will host a joint LED seminar with its sister company “MacDermid Enthone Electronics Solutions” at Westin Pazhou Hotel on June 10. In addition, Alpha will showcase its vast LED materials portfolio and will present a technical paper at the upcoming Guangzhou International Lighting Exhibition (GILE) taking place June 9th – 12th in China.

This free seminar demonstrates Alpha and MacDermid Enthone’s knowledgeable applications expertise and how they enable their customers to meet the evolving and demanding needs of the LED industry. The seminar will cover the key LED topics, such as flip-chip die attach technology, creep resistant, pin-in-test assembly process, process and materials approaches for low-voiding.

Apart from the half day seminar at Westin Pazhou hotel, Alpha will also present a paper, titled “Flip-Chip LED Assembly by Solder” at US Pavilion Presentation Area, Hall 11.2 E19 on Jun 9. “The paper will focus on displaying Alpha products dedicated for flip-chip LED die attach. These fine pitch capable materials (solder, sintered silver and conductive adhesives) have been put through LED packaging processes (like pin transfer / stamping and stencil printing – including 3D stencil, Dispensing etc) at Alpha’s dedicated LED packaging labs. LED packaging and LED module assembly makers who use flip chip for automotive, backlight and general lighting applications will find this talk very relevant.”, Said Gyan Dutt, Technical Marketing Manager – LED Technologies at Alpha Assembly Solutions.

During the lighting exhibition, Alpha will exhibit its LED compatible sintered die attach, conductive adhesives and solder assembly bonding materials at Booth # 11.2 D20. Encompassing a comprehensive product line for LED applications, Alpha offers an efficient and reliable solution for every bonding event throughout your assembly process from Die Attach & Package, Package on Board, Luminaire Module, to Power Driver/Supply and Control Systems.

To learn more about Alpha Assembly Solutions and its LED Technologies, please visit AlphaAssembly.com/Markets/LED

GILE (Guangzhou International Lighting Exhibition)
Date: June 9-12, 2017
Venue: China Import and Export Fair Complex, Guangzhou, China
Alpha at Booth # 11.2 D20

Presentation:
Date & Time: June 9, 2017 (Friday) @ 3:30 p.m. – 4:30 p.m.
Venue: US Pavilion Presentation Area, Hall 11.2 E19
Topic: Flip-Chip LED Assembly by Solder
Speaker: Gyan Dutt, Technical Marketing Manager – Alpha Assembly Solutions

Speaker Biography – Gyan Dutt
Gyan Dutt works for Alpha as Technical Marketing Manager for LED Technologies. He is responsible for the planning, organization and implementation of the ALPHA® product portfolio for LED packaging, interconnect and assembly. He has more than 13 years of experience in technical marketing, product development and applications engineering in semiconductor packaging in the US and Asia-Pacific Regions.

 
  
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