ALPHA® LUMET® HTP82

High Temperature Melting, Water Soluble, Lead Free Solder Paste for LED Die Attach

ALPHA® LUMET® HTP82 is a lead free, halide free,water soluble solder paste based on tin antimony alloy compositions. This paste provides ideal combination of printability and reflow window, with excellent water-based cleanability. It is an excellent choice forLED interconnects that need to withstand post assembly reflows and is particularly suitable for flip-chip LED interconnects (both die as well as wafer level)

FEATURES & BENEFITS

  • Cleanable with water based cleaning systems
  • Excellent print volume and print volume repeatability
  • Able to spread and wet using straight ramp or soak reflow profiles in air
  • High spread/wetting lead free paste compatible with lead free alloys and surface finishes
  • High Reflow Yield with IPC Class II Voiding Performance
 
  
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