Solder Paste

ALPHA® CVP-390 is a lead-free, Zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, down to 180µm circle printed with 100µm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Additionally, ALPHA® CVP-390 achieves IPC7095 Class III voiding performance.

Features and Benefits

  • Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition of new paste
  • Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment 
  • Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C 
  • Reduced Random Solder Ball Levels: minimizes rework and increases first time yield 
  • Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high soak profile environment
  • Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermal soaking, without charring or burning 
  • Excellent Voiding Performance: Meets IPC7095 Class III Requirement 
  • Halogen Content: Zero Halogen, no halogen intentionally added 
  • Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
  • Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements (see table below), as well as TOSCA & EINECS

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