ALPHA® OM-5300 no clean solder paste was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly. Like all ALPHA solder pastes, OM-5300 has excellent print volume repeatability to minimize variation in the print process. OM-5300 minimizes print cyle times through high print speeds and extended number of prints between stencil undercleaning.
OM-5300 is different due to its ability to withstand long, hot soak reflow profiles, allowing better wetting of lead free surfaces with tin lead paste alloy. Very low BGA voiding, in conjunction with very high post reflow SIR readings make OM-5300 ideal for tin lead soldering when lead free components are used.
OM-5300 is also a zero halogen product with no halogens intentionally added to the formulation.